Prior to joining Inside Remy was a Partner of VERTEX Venture in Europe and sat on the board of several technology and services companies of the VERTEX portfolio, including the chairmanship of INSIDE Contactless. From 1988 to 2001 Remy was with GEMPLUS in various position in sales and marketing and then, as a member of the executive committee of the group Chief Executive Officer of AsiaPacific operations from 91 to 98 based in Singapore and then in Redwood Shores (California) as CEO of US and Latin America operations .

Pascal Didier came to INSIDE from Gemplus, where he was Senior Vice President for e-Solutions. Having joined Gemplus at its creation, Pascal was part of the management team that set up Gemplus' North American subsidiary. Prior to Gemplus, he served as Marketing Manager for the Memory Division of SGS-Thomson Microelectronics. He also worked with Philips Components as integrated circuit designer and technical support engineer in France and in the United States.

Mr. Vacher Detournière joins INSIDE from Siparex, a leading independent French private equity and venture capital firm. Since joining Siparex in 1994, he has played a key role in more than 25 financing deals, including leveraged buy-outs, growth capital investments, and investments in early-stage technology companies. Most recently, he served as a partner in the area of information and communication technologies. From 2003 to 2005, based in California’s Silicon Valley, he helped manage SBV Venture Partners, an early-stage fund co-managed by Siparex. Before joining Siparex, he served as a consultant with Price Waterhouse in audit and corporate finance capacities, both in France and in Central Europe.
Mr. Vacher Detournière graduated from the Amiens School of Management and holds a master’s degree in management control, accounting and financial management (DESCF). He served on the board of thirteen Siparex portfolio companies, including Nanolase (sold to JDS Uniphase), SoiSic (sold to ARM), Leguide.com (listed on NYSE Alternext Paris by Euronext), EVE (hardware/software co-verification), and INSIDE Contactless. He also served on the audit committees for many of the firm’s portfolio companies.

Gary CHEW was formerly VP worldwide services at INSIDE. From 1993 to 2006 Gary CHEW held various technical management positions at Gemplus including Regional Technical Director for ASPAC, VP Software Engineering for the Americas and R&D software head at Gemplus. Gary CHEW has over 20 years of experience in systems design and software development in various environments including banking, mobile networks and enterprise security. He holds several patents in the smart cards industry.

Charles has more than ten years experience in the smart card sector. He was most recently EVP & COO for Diversinet, a Toronto headquartered mobile security company. Prior to that he was involved in both security and smart card related initiatives with Securify (SVP, Security Services), CertCo (COO), and Spyrus (Director of Electronic Commerce). As well, he was the co-founder of the CyberTrust business at GTE and instrumental in capturing key first contract wins with MasterCard, American Express, and in Japan through the CyberTrust Japan joint venture.

Philippe Martineau is responsible for developing INSIDE's worldwide emerging NFC business line on various market segments. Philippe's task is to enhance the company’s strategy, and position INSIDE’s offer within this strategic market.
Previously, Philippe spent the past 17 years in the smart card industry working for Gemplus in France including 3 years in the United States. Back in south of France he managed the Product Line of the Telecom Business Unit and later became Vice President 'Strategy'.

Damien Laroche started his career at SGS-Thomson Microelectronics as device engineer. In 1989, he joined Gemplus as engineering manager, to start off his main job being electrical & physical chip card characterization. Later, as module assembly industrial manager, he went on to build and launch the La Ciotat plant. In 1996, Gemplus, wishing to position itself in the contactless market, entrusted him with the job of Worldwide Industrial Director for Contactless Products. He was thus able to develop contactless card fabrication technologies (such as combi-cards) for the transport and access control markets, along with RFID labels for the laundry and library markets. He also acted as coordinator for the group's contactless production sites. Today Damien oversees all worldwide operations and manufacturing tasks for INSIDE including the Quality, Engineering, Logistics and Industrial Purchasing departments.

Bruno Charrat, one of the founding members of INSIDE Contactless who has held several technical positions with the company, started his career in reader design, and participated in the creation of INSIDE’s MicroPass microprocessor chip. He later worked on product definitions, while managing the development team. During this period, he actively participated in the ISO committee for the definition of the ISO 14443 and ISO 15693 standards, and still is an active member of the NFC Forum.

Goh Say Yeow has over 15 years of sales and marketing experiences in both the Information Technology and Smart Card businesses. Say Yeow headed Gemplus’ Financial and Security Service Business Unit in South East Asia. Prior to this, Say Yeow served as General Manager for Gemplus’ Taiwan and Hong Kong representative offices. Before moving to Taiwan and Hong Kong, Say Yeow held the title of Regional Sales Manager for Gemplus and was responsible for the sales operation in Thailand, Philippines and Indo-China.

Bertrand Moussel started his professional career in the semiconductor industry (ST and Texas Instruments), holding various positions in Marketing and Sales. In 1992, he joined Gemplus and built the Latin American business from the ground up. His responsibilities included Sales, Marketing, Development and Manufacturing. In 2003, he held the position of CEO of AVILINKS, a manufacturer of Telecom equipment for the Internet Broadband industry. By mid-2005, Bertrand joined Oberthur Card Systems to lead the Banking and Transport Business Units, to then be appointed South America Director.

A founding member of INSIDE Contactless, Didier worked at Gemplus, where he was project manager for the development of contactless tags and reader products. He has held several positions at INSIDE Contactless starting out as technical project leader for the development of analog circuits for contactless chips and readers prior to leading the RFID marketing group where he has played an active role in the evolution of Contactless ISO standards and has regularly contributed to the development of the ISO 14443 and 15693 standards. Didier then headed up INSIDE's sales activity as Executive Vice President of Sales where he has successfully developed a number of strategic businesses and new channels. Didier has then open INSIDE’s US office in California and is heading all Sales initiatives for North America.

Bernard came to INSIDE from Gemplus, where he held several positions in Sales Support and Marketing, in Europe and lately in the Gemplus' North America, where he opened the Californian office. As the Gemplus North America Technical Services Group Director, he handled the Visa Intl and VISA USA relationships, and qualified GEMPLUS as the largest VISA chip card vendor, with 20+ million of cards delivered to Bank Issuers as part of the first "smart Visa program" deployment in the US. He joined INSIDE's team at the end of 2002 as the Business Development VP. He has initiated the positioning of INSIDE's new microcontroller technology, MicroPass™ , one of the most promising technology dedicated to cost effective solution for proximity payment and secure ID applications